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The Research Association for Advanced Systems (Members: University of Tokyo, ADVANTEST, Toppan, Hitachi, MIRISE Technologies, RIKEN) Launches the Research and Development of a Next-Generation Advanced Semiconductor Design Platform for the Democratization of Chip Design.

Professor Suga, an advisor of RaaS and professor emeritus at the University of Tokyo, gave an invited talk on "Surface-activated Room-temperature Bonding as An Advanced 3D Integration Technology" at the 28th Workshop on Electron Device Interface Technology – Physics of Materials, Processes, and Device Characteristics (sponsored by Japan Society of Applied Physics).

RaaS presented on "Trends in Advanced Packaging Technology and Policy Recommendations" at the JEITA Scene-Oriented Advanced Implementation Technology Subcommittee Meeting.

RaaS participated in a poster session at SEMICON Japan/APCS 2022 held at Tokyo Big Sight.

RaaS presented on "Post-5G Project Efforts at The Research Association for Advanced Systems (RaaS)" at the IEEE EPS Japan Evening Meeting.

RaaS presented an "Introduction of Advanced Packaging-Related Activities" at the JEITA Advanced Packaging Committee Meeting.

RaaS presented on "Advanced Semiconductor Manufacturing (Backend) Process Technology Development" in a panel discussion at the Opening Symposium of the Advanced Semiconductor Manufacturing Technology Tsukuba Innovation Hub.

Proposal from RaaS has been selected by Japan’s Ministry of Economy, Trade and Industry (METI) for its “Project for Research and Development of Enhanced Infrastructures for Post 5G Information and Communications Systems / Development of Advanced Semiconductor Manufacturing Technology (Subsidized).”

The University of Tokyo, Toppan Inc., Panasonic Corporation, Hitachi Ltd., and MIRISE Technologies, with the approval of Japan’s Ministry of Economy, Trade and Industry, established the Research Association for Advanced Systems (RaaS) on Aug 17, 2020.